MediaTek to Use Intel’s Advanced Chip Packaging for Next-Generation AI Processors

MediaTek is expanding its partnership with Intel by adopting the company’s advanced EMIB-T (Embedded Multi-die Interconnect Bridge) packaging technology for future artificial intelligence processors. The announcement marks the first official confirmation that MediaTek will use Intel’s cutting-edge packaging platform as part of its AI chip strategy, while continuing to support TSMC’s widely used CoWoS packaging technology. By offering both options, MediaTek aims to give customers greater flexibility when designing high-performance AI accelerators for data centers and cloud computing.

Advanced chip packaging has become one of the most important technologies in the AI era. Instead of building a processor from a single piece of silicon, modern AI chips combine multiple specialized chiplets into a single package, dramatically improving performance, power efficiency, and scalability. Intel’s EMIB-T technology enables faster communication between these chiplets while reducing manufacturing complexity, making it an attractive alternative as demand for AI hardware continues to outpace supply. Industry experts believe advanced packaging is now just as critical as the chip manufacturing process itself.

MediaTek’s decision comes as the company rapidly expands beyond its traditional smartphone business into custom AI chips for major cloud providers. The company expects the global market for custom AI application-specific integrated circuits (ASICs) to reach tens of billions of dollars over the next few years and is investing heavily to secure a meaningful share of that opportunity. Supporting both Intel’s EMIB-T and TSMC’s CoWoS technologies allows customers to choose the packaging solution that best fits their performance, cost, and production requirements.

For Intel, the agreement represents an important victory in its effort to grow its foundry and semiconductor packaging business. The company has invested billions of dollars in advanced manufacturing and packaging technologies to compete more directly with TSMC and Samsung. Winning MediaTek as a customer strengthens Intel’s position in the rapidly growing AI semiconductor ecosystem and demonstrates increasing industry confidence in its packaging capabilities, particularly as demand strains existing manufacturing capacity.

The partnership highlights how competition in the semiconductor industry is shifting beyond chip design to the technologies used to assemble increasingly complex AI processors. As hyperscale cloud providers and AI developers demand more powerful and energy-efficient hardware, advanced packaging is becoming a key differentiator. MediaTek’s dual-packaging strategy reflects the industry’s move toward greater flexibility and supply chain diversification, ensuring customers can continue building next-generation AI infrastructure despite ongoing capacity constraints across the semiconductor sector.